Influence of Coagulation Bath Temperature on the Structure and Dielectric Properties of Porous Polyimide Films in Different Solvent Systems

[Image: see text] In this work, the effect of coagulation bath temperature in different solvent systems [1,4-butyrolactone (GBL)/N,N-dimethylacetamide (DMAC)] on the structure and dielectric properties of polyimide (PI) films was investigated for the first time. The solubility parameter was introduced to explain the formation process of porous PI films. The results showed that the changed tendency of the dielectric constant versus temperature is opposite for the single-solvent system and cosolvent system. For a single DMAC and GBL solvent, the dielectric constants of the films decreased with increasing temperature. In contrast, the dielectric constants increased with the increase in temperature for the GBL/DMAC cosolvent system. Moreover, the measured porosities were applied to estimate the dielectric constants of the PI films. This showed that the porosity increased with increasing temperature for a single-solvent system, while it decreased for a cosolvent system. Scanning electron microscopy images suggested that the variation trends are derived from the different influences of the temperature on the structure and morphology. Thus, this study reveals the effect of coagulation bath temperature on the structure and dielectric properties of porous PI films and provides the guidance for the design and optimization of architectures for high-performance porous films.