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Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins

A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermome...

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Detalles Bibliográficos
Autores principales: Lin, Chih-Hao, Chen, Wen-Bin, Whang, Wha-Tzong, Chen, Chun-Hua
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7692388/
https://www.ncbi.nlm.nih.gov/pubmed/33126641
http://dx.doi.org/10.3390/polym12112510
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author Lin, Chih-Hao
Chen, Wen-Bin
Whang, Wha-Tzong
Chen, Chun-Hua
author_facet Lin, Chih-Hao
Chen, Wen-Bin
Whang, Wha-Tzong
Chen, Chun-Hua
author_sort Lin, Chih-Hao
collection PubMed
description A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.
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spelling pubmed-76923882020-11-28 Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins Lin, Chih-Hao Chen, Wen-Bin Whang, Wha-Tzong Chen, Chun-Hua Polymers (Basel) Communication A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications. MDPI 2020-10-28 /pmc/articles/PMC7692388/ /pubmed/33126641 http://dx.doi.org/10.3390/polym12112510 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Lin, Chih-Hao
Chen, Wen-Bin
Whang, Wha-Tzong
Chen, Chun-Hua
Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title_full Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title_fullStr Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title_full_unstemmed Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title_short Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
title_sort characteristics of thermosetting polymer nanocomposites: siloxane-imide-containing benzoxazine with silsesquioxane epoxy resins
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7692388/
https://www.ncbi.nlm.nih.gov/pubmed/33126641
http://dx.doi.org/10.3390/polym12112510
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