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Mixed-dimensional MXene-hydrogel heterostructures for electronic skin sensors with ultrabroad working range

Skin-mountable microelectronics are garnering substantial interest for various promising applications including human-machine interfaces, biointegrated devices, and personalized medicine. However, it remains a critical challenge to develop e-skins to mimic the human somatosensory system in full work...

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Detalles Bibliográficos
Autores principales: Cai, Yichen, Shen, Jie, Yang, Chi-Wen, Wan, Yi, Tang, Hao-Ling, Aljarb, Areej A., Chen, Cailing, Fu, Jui-Han, Wei, Xuan, Huang, Kuo-Wei, Han, Yu, Jonas, Steven J., Dong, Xiaochen, Tung, Vincent
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7695469/
https://www.ncbi.nlm.nih.gov/pubmed/33246950
http://dx.doi.org/10.1126/sciadv.abb5367
Descripción
Sumario:Skin-mountable microelectronics are garnering substantial interest for various promising applications including human-machine interfaces, biointegrated devices, and personalized medicine. However, it remains a critical challenge to develop e-skins to mimic the human somatosensory system in full working range. Here, we present a multifunctional e-skin system with a heterostructured configuration that couples vinyl-hybrid-silica nanoparticle (VSNP)–modified polyacrylamide (PAM) hydrogel with two-dimensional (2D) MXene through nano-bridging layers of polypyrrole nanowires (PpyNWs) at the interfaces, featuring high toughness and low hysteresis, in tandem with controlled crack generation and distribution. The multidimensional configurations endow the e-skin with an extraordinary working range (2800%), ultrafast responsiveness (90 ms) and resilience (240 ms), good linearity (800%), tunable sensing mechanisms, and excellent reproducibility. In parallel, this e-skin platform is capable of detecting, quantifying, and remotely monitoring stretching motions in multiple dimensions, tactile pressure, proximity sensing, and variations in temperature and light, establishing a promising platform for next-generation smart flexible electronics.