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Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing

Recently, the accumulative roll bonding (ARB) technique has made significant progress in the production of various ultrafine-grained (UFG) metals and alloys. In this work, a UFG copper sheet was produced by ARB and subsequent annealing at 300 °C for 60 min to optimize strength and ductility. It was...

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Autores principales: Liu, Xueran, Zhuang, Limin, Zhao, Yonghao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7696677/
https://www.ncbi.nlm.nih.gov/pubmed/33207840
http://dx.doi.org/10.3390/ma13225171
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author Liu, Xueran
Zhuang, Limin
Zhao, Yonghao
author_facet Liu, Xueran
Zhuang, Limin
Zhao, Yonghao
author_sort Liu, Xueran
collection PubMed
description Recently, the accumulative roll bonding (ARB) technique has made significant progress in the production of various ultrafine-grained (UFG) metals and alloys. In this work, a UFG copper sheet was produced by ARB and subsequent annealing at 300 °C for 60 min to optimize strength and ductility. It was found that homogeneous lamellar UFG materials with a thickness of 200–300 nm were formed after six ARB passes. The microhardness and tensile strength of as-ARBed Cu increased, while the ductility and strain hardening decreased with the cumulative deformation strain. The as-ARBed specimens fractured in a macroscopically brittle and microscopically ductile way. After annealing, discontinuous recrystallization occurred in the neighboring interface with high strain energy, which was prior to that in the matrix. The recrystallization rate was enhanced by increasing the cumulative strain. UFG Cu ARBed for six passes after annealing manifested a completely recrystallized microstructure with grain sizes approximately ranging from 5 to 10 μm. Annealing treatment reduced the microhardness and tensile strength but improved the ductility and strain hardening of UFG Cu. As-annealed UFG-Cu fractured in a ductile mode with dominant dimples and shear zones. Our work advances the industrial-scale production of UFG Cu by exploring a simple and low-cost fabrication technique.
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spelling pubmed-76966772020-11-29 Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing Liu, Xueran Zhuang, Limin Zhao, Yonghao Materials (Basel) Article Recently, the accumulative roll bonding (ARB) technique has made significant progress in the production of various ultrafine-grained (UFG) metals and alloys. In this work, a UFG copper sheet was produced by ARB and subsequent annealing at 300 °C for 60 min to optimize strength and ductility. It was found that homogeneous lamellar UFG materials with a thickness of 200–300 nm were formed after six ARB passes. The microhardness and tensile strength of as-ARBed Cu increased, while the ductility and strain hardening decreased with the cumulative deformation strain. The as-ARBed specimens fractured in a macroscopically brittle and microscopically ductile way. After annealing, discontinuous recrystallization occurred in the neighboring interface with high strain energy, which was prior to that in the matrix. The recrystallization rate was enhanced by increasing the cumulative strain. UFG Cu ARBed for six passes after annealing manifested a completely recrystallized microstructure with grain sizes approximately ranging from 5 to 10 μm. Annealing treatment reduced the microhardness and tensile strength but improved the ductility and strain hardening of UFG Cu. As-annealed UFG-Cu fractured in a ductile mode with dominant dimples and shear zones. Our work advances the industrial-scale production of UFG Cu by exploring a simple and low-cost fabrication technique. MDPI 2020-11-16 /pmc/articles/PMC7696677/ /pubmed/33207840 http://dx.doi.org/10.3390/ma13225171 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Liu, Xueran
Zhuang, Limin
Zhao, Yonghao
Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title_full Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title_fullStr Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title_full_unstemmed Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title_short Microstructure and Mechanical Properties of Ultrafine-Grained Copper by Accumulative Roll Bonding and Subsequent Annealing
title_sort microstructure and mechanical properties of ultrafine-grained copper by accumulative roll bonding and subsequent annealing
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7696677/
https://www.ncbi.nlm.nih.gov/pubmed/33207840
http://dx.doi.org/10.3390/ma13225171
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AT zhaoyonghao microstructureandmechanicalpropertiesofultrafinegrainedcopperbyaccumulativerollbondingandsubsequentannealing