The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution. It was observed that there was a grain rotation phenomenon during current stressing by in-situ electron backscattered diffraction (EBSD). Th...

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Detalles Bibliográficos
Autores principales: Fu, Xing, Liu, Min, Xu, KeXin, Chen, Si, Shi, YiJun, Fu, ZhiWei, Huang, Yun, Chen, HongTao, Yao, RuoHe
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7730036/
https://www.ncbi.nlm.nih.gov/pubmed/33276575
http://dx.doi.org/10.3390/ma13235497

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7730036/
https://www.ncbi.nlm.nih.gov/pubmed/33276575
http://dx.doi.org/10.3390/ma13235497

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