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Residual Stress Reduction Technology in Heterogeneous Metal Additive Manufacturing

Metal additive manufacturing (AM) is a low-cost, high-efficiency functional mold manufacturing technology. However, when the functional section of the mold or part is not a partial area, and large-area additive processing of high-hardness metal is required, cracks occur frequently in AM and substrat...

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Detalles Bibliográficos
Autores principales: Hong, Myoung-Pyo, Kim, Young-Suk
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7730888/
https://www.ncbi.nlm.nih.gov/pubmed/33287218
http://dx.doi.org/10.3390/ma13235516
Descripción
Sumario:Metal additive manufacturing (AM) is a low-cost, high-efficiency functional mold manufacturing technology. However, when the functional section of the mold or part is not a partial area, and large-area additive processing of high-hardness metal is required, cracks occur frequently in AM and substrate materials owing to thermal stress and the accumulation of residual stresses. Hence, research on residual stress reduction technologies is required. In this study, we investigated the effect of reducing residual stress due to thermal deviation reduction using a real-time heating device as well as changes in laser power in the AM process for both high-hardness cold and hot work mold steel. The residual stress was measured using an X-ray stress diffraction device before and after AM. Compared to the AM processing conditions at room temperature (25 °C), residual stress decreased by 57% when the thermal deviation was reduced. The microstructures and mechanical properties of AM specimens manufactured under room-temperature and real-time preheating and heating conditions were analyzed using an optical microscope. Qualitative evaluation of the effect of reducing residual stress, which was quantitatively verified in a small specimen, confirmed that the residual stress decreased for a large-area curved specimen in which concentrated stress was generated during AM processing.