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Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications
Due to sensor size and supporting circuitry, in-vivo load and deformation measurements are currently restricted to applications within larger orthopaedic implants. The objective of this study is to repurpose a commercially available low-power, miniature, wireless, telemetric, tire-pressure sensor (F...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7731148/ https://www.ncbi.nlm.nih.gov/pubmed/33260821 http://dx.doi.org/10.3390/s20236772 |
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author | Anderson, William D. Wilson, Sydney L. M. Holdsworth, David W. |
author_facet | Anderson, William D. Wilson, Sydney L. M. Holdsworth, David W. |
author_sort | Anderson, William D. |
collection | PubMed |
description | Due to sensor size and supporting circuitry, in-vivo load and deformation measurements are currently restricted to applications within larger orthopaedic implants. The objective of this study is to repurpose a commercially available low-power, miniature, wireless, telemetric, tire-pressure sensor (FXTH87) to measure load and deformation for future use in orthopaedic and biomedical applications. The capacitive transducer membrane was modified, and compressive deformation was applied to the transducer to determine the sensor signal value and the internal resistive force. The sensor package was embedded within a deformable enclosure to illustrate potential applications of the sensor for monitoring load. To reach the maximum output signal value, sensors required compressive deformation of 350 ± 24 µm. The output signal value of the sensor was an effective predictor of the applied load on a calibrated plastic strain member, over a range of 35 N. The FXTH87 sensor can effectively sense and transmit load-induced deformations. The sensor does not have a limit on loads it can measure, as long as deformation resulting from the applied load does not exceed 350 µm. The proposed device presents a sensitive and precise means to monitor deformation and load within small-scale, deformable enclosures. |
format | Online Article Text |
id | pubmed-7731148 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-77311482020-12-12 Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications Anderson, William D. Wilson, Sydney L. M. Holdsworth, David W. Sensors (Basel) Article Due to sensor size and supporting circuitry, in-vivo load and deformation measurements are currently restricted to applications within larger orthopaedic implants. The objective of this study is to repurpose a commercially available low-power, miniature, wireless, telemetric, tire-pressure sensor (FXTH87) to measure load and deformation for future use in orthopaedic and biomedical applications. The capacitive transducer membrane was modified, and compressive deformation was applied to the transducer to determine the sensor signal value and the internal resistive force. The sensor package was embedded within a deformable enclosure to illustrate potential applications of the sensor for monitoring load. To reach the maximum output signal value, sensors required compressive deformation of 350 ± 24 µm. The output signal value of the sensor was an effective predictor of the applied load on a calibrated plastic strain member, over a range of 35 N. The FXTH87 sensor can effectively sense and transmit load-induced deformations. The sensor does not have a limit on loads it can measure, as long as deformation resulting from the applied load does not exceed 350 µm. The proposed device presents a sensitive and precise means to monitor deformation and load within small-scale, deformable enclosures. MDPI 2020-11-27 /pmc/articles/PMC7731148/ /pubmed/33260821 http://dx.doi.org/10.3390/s20236772 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Anderson, William D. Wilson, Sydney L. M. Holdsworth, David W. Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title | Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title_full | Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title_fullStr | Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title_full_unstemmed | Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title_short | Development of a Wireless Telemetry Sensor Device to Measure Load and Deformation in Orthopaedic Applications |
title_sort | development of a wireless telemetry sensor device to measure load and deformation in orthopaedic applications |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7731148/ https://www.ncbi.nlm.nih.gov/pubmed/33260821 http://dx.doi.org/10.3390/s20236772 |
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