Enhanced Thermal Conductivity of Epoxy Composites Filled with Al(2)O(3)/Boron Nitride Hybrids for Underfill Encapsulation Materials

In this study, a thermal conductivity of 0.22 W·m(−1)·K(−1) was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al(2)O(3)) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al(2)O(3)–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m(−1)·K(−1), increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (T(g)), decomposition temperature (T(d)), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.