Cargando…
The Impact of Process Conditions on Surge Current Capability of 1.2 kV SiC JBS and MPS Diodes
This paper demonstrated the impact of process conditions on the surge current capability of 1.2 kV SiC junction barrier Schottky diode (JBS) and merged PiN Schottky diode (MPS). The influence of ohmic contact and defect density produced by implantation was studied in the simulation. The device fabri...
Autores principales: | Xu, Hongyi, Ren, Na, Wu, Jiupeng, Zhu, Zhengyun, Guo, Qing, Sheng, Kuang |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7867016/ https://www.ncbi.nlm.nih.gov/pubmed/33572683 http://dx.doi.org/10.3390/ma14030663 |
Ejemplares similares
-
Investigation of 1200 V SiC MOSFETs’ Surge Reliability
por: Li, Huan, et al.
Publicado: (2019) -
High-Performance Temperature Sensors Based on Dual 4H-SiC JBS and SBD Devices
por: Min, Seong-Ji, et al.
Publicado: (2020) -
A Low-Loss 1.2 kV SiC MOSFET with Improved UIS Performance
por: Wu, Lijuan, et al.
Publicado: (2023) -
GaN JBS Diode Device Performance Prediction Method Based on Neural Network
por: Ma, Hao, et al.
Publicado: (2023) -
The effect of wafer thinning and thermal capacitance on chip temperature of SiC Schottky diodes during surge currents
por: Damcevska, Jenny, et al.
Publicado: (2023)