Cargando…
A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers
In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) accelerometers, the entire structure of the accelerometer, includes the mass, the springs, and the composite wafer. The composite waf...
Autores principales: | He, Yurong, Si, Chaowei, Han, Guowei, Zhao, Yongmei, Ning, Jin, Yang, Fuhua |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7911678/ https://www.ncbi.nlm.nih.gov/pubmed/33494437 http://dx.doi.org/10.3390/mi12020102 |
Ejemplares similares
-
Research on Wafer-Level MEMS Packaging with Through-Glass Vias
por: Yang, Fan, et al.
Publicado: (2018) -
Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via †
por: Zhang, Meng, et al.
Publicado: (2018) -
A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process
por: Rao, Kang, et al.
Publicado: (2019) -
A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process
por: Merdassi, Adel, et al.
Publicado: (2015) -
A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost
por: Fu, Yingchun, et al.
Publicado: (2022)