Defect Filling Method of Sensor Encapsulation Based on Micro-Nano Composite Structure with Parylene Coating

The demand for waterproofing of polymer (parylene) coating encapsulation has increased in a wide variety of applications, especially in the waterproof protection of electronic devices. However, parylene coatings often produce pinholes and cracks, which will reduce the waterproof effect as a protective barrier. This characteristic has a more significant influence on sensors and actuators with movable parts. Thus, a defect filling method of micro-nano composite structure is proposed to improve the waterproof ability of parylene coatings. The defect filling method is composed of a nano layer of Al(2)O(3) molecules and a micro layer of parylene polymer. Based on the diffusion mechanism of water molecules in the polymer membrane, defects on the surface of polymer encapsulation will be filled and decomposed into smaller areas by Al(2)O(3) nanoparticles to delay or hinder the penetration of water molecules. Accordingly, the dense Al(2)O(3) nanoparticles are utilized to fill and repair the surface of the organic polymer by low-rate atomic layer deposition. This paper takes the pressure sensor as an example to carry out the corresponding research. Experimental results show that the proposed method is very effective and the encapsulated sensors work properly in a saline solution after a period of time equivalent to 153.9 days in body temperature, maintaining their accuracy and precision of 2 mmHg. Moreover, the sensors could improve accuracy by about 43% after the proposed encapsulation. Therefore, the water molecule anti-permeability encapsulation would have broad application prospects in micro/nano-device protection.