Comparative Evaluation of Cu(acac)(2) and {[Cu(μ-O,O′-NO(3)) (L-arg) (2,2′-bpy)]·NO(3)}(n) as Potential Precursors of Electroless Metallization of Laser-Activated Polymer Materials

This paper presents a comparative assessment of Cu(acac)(2) and {[Cu(μ-O,O′-NO(3)) (L-arg)(2,2′-bpy)]·NO(3)}(n) as potential precursors for the electroless metallization of laser activated polymer materials. Coatings consisting of polyurethane resin, one of the two mentioned precursor compounds, and antimony oxide (Sb(2)O(3)), as a compound strongly absorbing infrared radiation, were applied on the polycarbonate substrate. The coatings were activated with infrared Nd: YAG laser radiation (λ = 1064 nm) and electroless metallized. It was found that after laser irradiation, a micro-rough surface structure of the coatings was formed, on which copper was present in various oxidation states, as well as in its metallic form. For selected parameters of laser irradiation, it was possible to deposit a copper layer on the coating containing Cu(acac)(2) and Sb(2)O(3), which is characterized by high adhesion strength. It was also found that the {[Cu(μ-O,O′-NO(3)) (L-arg)(2,2′-bpy)]·NO(3)}(n) complex was not an effective precursor for the electroless metallization of Nd:YAG laser activated coatings. An attempt was made to determine the influence of the precursor chemical structure on the obtained metallization effects.