In Situ Monitoring of Additive Manufacturing Using Digital Image Correlation: A Review

This paper is a critical review of in situ full-field measurements provided by digital image correlation (DIC) for inspecting and enhancing additive manufacturing (AM) processes. The principle of DIC is firstly recalled and its applicability during different AM processes systematically addressed. Relevant customisations of DIC in AM processes are highlighted regarding optical system, lighting and speckled pattern procedures. A perspective is given in view of the impact of in situ monitoring regarding AM processes based on target subjects concerning defect characterisation, evaluation of residual stresses, geometric distortions, strain measurements, numerical modelling validation and material characterisation. Finally, a case study on in situ measurements with DIC for wire and arc additive manufacturing (WAAM) is presented emphasizing opportunities, challenges and solutions.