Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism...

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Detalles Bibliográficos
Autores principales: Choi, Gwang-Mun, Jang, Ki-Seok, Choi, Kwang-Seong, Joo, Jiho, Yun, Ho-Gyeong, Lee, Chanmi, Eom, Yong-Sung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8003902/
https://www.ncbi.nlm.nih.gov/pubmed/33804756
http://dx.doi.org/10.3390/polym13060957

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8003902/
https://www.ncbi.nlm.nih.gov/pubmed/33804756
http://dx.doi.org/10.3390/polym13060957

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