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Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface
Die soldering of die castings is a serious problem in the aluminum casting industry. The precise mechanism, the influence of the alloy composition, and the options for prevention have not yet been fully elaborated. A well-established solution for alloys with low iron content is the addition of manga...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8036270/ https://www.ncbi.nlm.nih.gov/pubmed/33804951 http://dx.doi.org/10.3390/ma14071580 |
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author | Kohlhepp, Marius Uggowitzer, Peter J. Hummel, Marc Höppel, Heinz Werner |
author_facet | Kohlhepp, Marius Uggowitzer, Peter J. Hummel, Marc Höppel, Heinz Werner |
author_sort | Kohlhepp, Marius |
collection | PubMed |
description | Die soldering of die castings is a serious problem in the aluminum casting industry. The precise mechanism, the influence of the alloy composition, and the options for prevention have not yet been fully elaborated. A well-established solution for alloys with low iron content is the addition of manganese. However, up to 0.8 wt.% is necessary, which increases the amount of brittle phases in the material and consequently reduces ductility. Immersion tests with 1.2343 tool steel and pure aluminum as well as a hypoeutectic AlSi-alloy with Mn, Mo, Co, and Cr additions were carried out to systematically investigate the formation of die soldering. Three different intermetallic layers and a scattered granular intermetallic phase formed at the interface between steel and Al-alloy after immersion into the melt for a duration of 6 min at 710 °C. The combined presence of the irregular, needle-shaped β-Al(5)FeSi phase and the surrounding alloy was responsible for the bond between the two components. Mn and Mo inhibited the formation of the β-phase, and instead promoted the α(C)-Al(15)(Fe,X)(3)Si(2) phase. This led to an evenly running boundary to the AlSi-alloy and thus prevented bonding. Cr has proven to be the most efficient addition against die soldering, with 0.2 wt.% being sufficient. Contrary to the other elements investigated, Cr also reduced the thickness of the intermetallic interface. |
format | Online Article Text |
id | pubmed-8036270 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-80362702021-04-12 Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface Kohlhepp, Marius Uggowitzer, Peter J. Hummel, Marc Höppel, Heinz Werner Materials (Basel) Article Die soldering of die castings is a serious problem in the aluminum casting industry. The precise mechanism, the influence of the alloy composition, and the options for prevention have not yet been fully elaborated. A well-established solution for alloys with low iron content is the addition of manganese. However, up to 0.8 wt.% is necessary, which increases the amount of brittle phases in the material and consequently reduces ductility. Immersion tests with 1.2343 tool steel and pure aluminum as well as a hypoeutectic AlSi-alloy with Mn, Mo, Co, and Cr additions were carried out to systematically investigate the formation of die soldering. Three different intermetallic layers and a scattered granular intermetallic phase formed at the interface between steel and Al-alloy after immersion into the melt for a duration of 6 min at 710 °C. The combined presence of the irregular, needle-shaped β-Al(5)FeSi phase and the surrounding alloy was responsible for the bond between the two components. Mn and Mo inhibited the formation of the β-phase, and instead promoted the α(C)-Al(15)(Fe,X)(3)Si(2) phase. This led to an evenly running boundary to the AlSi-alloy and thus prevented bonding. Cr has proven to be the most efficient addition against die soldering, with 0.2 wt.% being sufficient. Contrary to the other elements investigated, Cr also reduced the thickness of the intermetallic interface. MDPI 2021-03-24 /pmc/articles/PMC8036270/ /pubmed/33804951 http://dx.doi.org/10.3390/ma14071580 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) ). |
spellingShingle | Article Kohlhepp, Marius Uggowitzer, Peter J. Hummel, Marc Höppel, Heinz Werner Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title | Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title_full | Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title_fullStr | Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title_full_unstemmed | Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title_short | Formation of Die Soldering and the Influence of Alloying Elements on the Intermetallic Interface |
title_sort | formation of die soldering and the influence of alloying elements on the intermetallic interface |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8036270/ https://www.ncbi.nlm.nih.gov/pubmed/33804951 http://dx.doi.org/10.3390/ma14071580 |
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