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Weaker bonding can give larger thermal conductance at highly mismatched interfaces

Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. Th...

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Autores principales: Xu, Bin, Hu, Shiqian, Hung, Shih-Wei, Shao, Cheng, Chandra, Harsh, Chen, Fu-Rong, Kodama, Takashi, Shiomi, Junichiro
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8064637/
https://www.ncbi.nlm.nih.gov/pubmed/33893088
http://dx.doi.org/10.1126/sciadv.abf8197
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author Xu, Bin
Hu, Shiqian
Hung, Shih-Wei
Shao, Cheng
Chandra, Harsh
Chen, Fu-Rong
Kodama, Takashi
Shiomi, Junichiro
author_facet Xu, Bin
Hu, Shiqian
Hung, Shih-Wei
Shao, Cheng
Chandra, Harsh
Chen, Fu-Rong
Kodama, Takashi
Shiomi, Junichiro
author_sort Xu, Bin
collection PubMed
description Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. This occurs in a system with highly mismatched vibrational frequencies (copper/diamond) modified by a self-assembled monolayer. Using finely controlled fabrication and detailed characterization, complemented by molecular simulation, the effects of bridging the vibrational spectrum mismatch and bonding at the interface are systematically varied and understood from a molecular dynamics viewpoint. The results reveal that the bridging and binding effects have a trade-off relationship and, consequently, that the bridging can overwhelm the binding effect at a highly mismatched interface. This study provides a comprehensive understanding of phonon transport at interfaces, unifying physical and chemical understandings, and allowing interfacial tailoring of the thermal transport in various material systems.
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spelling pubmed-80646372021-05-05 Weaker bonding can give larger thermal conductance at highly mismatched interfaces Xu, Bin Hu, Shiqian Hung, Shih-Wei Shao, Cheng Chandra, Harsh Chen, Fu-Rong Kodama, Takashi Shiomi, Junichiro Sci Adv Research Articles Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. This occurs in a system with highly mismatched vibrational frequencies (copper/diamond) modified by a self-assembled monolayer. Using finely controlled fabrication and detailed characterization, complemented by molecular simulation, the effects of bridging the vibrational spectrum mismatch and bonding at the interface are systematically varied and understood from a molecular dynamics viewpoint. The results reveal that the bridging and binding effects have a trade-off relationship and, consequently, that the bridging can overwhelm the binding effect at a highly mismatched interface. This study provides a comprehensive understanding of phonon transport at interfaces, unifying physical and chemical understandings, and allowing interfacial tailoring of the thermal transport in various material systems. American Association for the Advancement of Science 2021-04-23 /pmc/articles/PMC8064637/ /pubmed/33893088 http://dx.doi.org/10.1126/sciadv.abf8197 Text en Copyright © 2021 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). https://creativecommons.org/licenses/by-nc/4.0/This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (https://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.
spellingShingle Research Articles
Xu, Bin
Hu, Shiqian
Hung, Shih-Wei
Shao, Cheng
Chandra, Harsh
Chen, Fu-Rong
Kodama, Takashi
Shiomi, Junichiro
Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title_full Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title_fullStr Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title_full_unstemmed Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title_short Weaker bonding can give larger thermal conductance at highly mismatched interfaces
title_sort weaker bonding can give larger thermal conductance at highly mismatched interfaces
topic Research Articles
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8064637/
https://www.ncbi.nlm.nih.gov/pubmed/33893088
http://dx.doi.org/10.1126/sciadv.abf8197
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