The Influence of Crystal Orientation on Subsurface Damage of Mono-Crystalline Silicon by Bound-Abrasive Grinding

Subsurface damage (SSD) produced in a grinding process will affect the performance and operational duration of single-crystal silicon. In order to reduce the subsurface damage depth generated during the grinding process by adjusting the process parameters (added), experiments were designed to invest...

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Detalles Bibliográficos
Autores principales: Yang, Wei, Li, Yaguo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8065456/
https://www.ncbi.nlm.nih.gov/pubmed/33800629
http://dx.doi.org/10.3390/mi12040365

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8065456/
https://www.ncbi.nlm.nih.gov/pubmed/33800629
http://dx.doi.org/10.3390/mi12040365

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