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In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage
This study used controlled microwaves to elucidate the response of adhesive components to microwaves and examined the advantages of microwave radiation in curing epoxy adhesives. Curing of adhesives with microwaves proceeded very rapidly, even though each component of the adhesive was not efficientl...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8069247/ https://www.ncbi.nlm.nih.gov/pubmed/33924444 http://dx.doi.org/10.3390/molecules26082240 |
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author | Horikoshi, Satoshi Arai, Yuhei Serpone, Nick |
author_facet | Horikoshi, Satoshi Arai, Yuhei Serpone, Nick |
author_sort | Horikoshi, Satoshi |
collection | PubMed |
description | This study used controlled microwaves to elucidate the response of adhesive components to microwaves and examined the advantages of microwave radiation in curing epoxy adhesives. Curing of adhesives with microwaves proceeded very rapidly, even though each component of the adhesive was not efficiently heated by the microwaves. The reason the adhesive cured rapidly is that microwave heating was enhanced by the electrically charged (ionic) intermediates produced by the curing reaction. In contrast, the cured adhesive displayed lower microwave absorption and lower heating efficiency, suggesting that the cured adhesive stopped heating even if it continued to be exposed to microwaves. This is a definite advantage in the curing of adhesives with microwaves, as, for example, adhesives dropped onto polystyrene could be cured using microwave heating without degrading the polystyrene base substrate. |
format | Online Article Text |
id | pubmed-8069247 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-80692472021-04-26 In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage Horikoshi, Satoshi Arai, Yuhei Serpone, Nick Molecules Article This study used controlled microwaves to elucidate the response of adhesive components to microwaves and examined the advantages of microwave radiation in curing epoxy adhesives. Curing of adhesives with microwaves proceeded very rapidly, even though each component of the adhesive was not efficiently heated by the microwaves. The reason the adhesive cured rapidly is that microwave heating was enhanced by the electrically charged (ionic) intermediates produced by the curing reaction. In contrast, the cured adhesive displayed lower microwave absorption and lower heating efficiency, suggesting that the cured adhesive stopped heating even if it continued to be exposed to microwaves. This is a definite advantage in the curing of adhesives with microwaves, as, for example, adhesives dropped onto polystyrene could be cured using microwave heating without degrading the polystyrene base substrate. MDPI 2021-04-13 /pmc/articles/PMC8069247/ /pubmed/33924444 http://dx.doi.org/10.3390/molecules26082240 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Horikoshi, Satoshi Arai, Yuhei Serpone, Nick In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title | In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title_full | In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title_fullStr | In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title_full_unstemmed | In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title_short | In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage |
title_sort | in search of the driving factor for the microwave curing of epoxy adhesives and for the protection of the base substrate against thermal damage |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8069247/ https://www.ncbi.nlm.nih.gov/pubmed/33924444 http://dx.doi.org/10.3390/molecules26082240 |
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