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Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding

W-20 wt.% Cu pseudo-alloys were produced via powder injection molding (PIM) with powders prepared thermochemically. Bonding treatment and ball milling (BTBM) were used, and the effects of BTBM on the characteristics of the powders, rheological properties of the feedstock, shrinkage and properties of...

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Autores principales: Ouyang, Mingliang, Wang, Cuiping, Zhang, Huayu, Liu, Xingjun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8070053/
https://www.ncbi.nlm.nih.gov/pubmed/33920304
http://dx.doi.org/10.3390/ma14081897
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author Ouyang, Mingliang
Wang, Cuiping
Zhang, Huayu
Liu, Xingjun
author_facet Ouyang, Mingliang
Wang, Cuiping
Zhang, Huayu
Liu, Xingjun
author_sort Ouyang, Mingliang
collection PubMed
description W-20 wt.% Cu pseudo-alloys were produced via powder injection molding (PIM) with powders prepared thermochemically. Bonding treatment and ball milling (BTBM) were used, and the effects of BTBM on the characteristics of the powders, rheological properties of the feedstock, shrinkage and properties of the sintered samples were studied. The morphology of the powder changed from extremely agglomerated small particles to pebble-shaped smooth large particles which were composed of several small particles combined tightly. The tap density increased from 3.25 g/cm(3) to 7.22 g/cm(3), and the specific surface area decreased from 0.86 m(2)/g to 0.45 m(2)/g. The critical powder loading of the feedstock increased from 45 vol.% to 56 vol.% due to the change in powder characteristics, thereby improving densification and dimension precision. For the PIM samples sintered at 1290 °C for 120 min in a hydrogen gas, the oversizing factor decreased from 1.297 to 1.216, and the dimension fluctuation ratio decreased from ±0.61% to ±0.33%. At the same time, the relative density increased from 97.8% to 98.6%, the thermal conductivity increased from 218 W/(m·K) to 233 W/(m·K), and the average coefficients of thermal expansion were roughly similar, within the range of 8.43–8.52 × 10(−6)/K.
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spelling pubmed-80700532021-04-26 Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding Ouyang, Mingliang Wang, Cuiping Zhang, Huayu Liu, Xingjun Materials (Basel) Article W-20 wt.% Cu pseudo-alloys were produced via powder injection molding (PIM) with powders prepared thermochemically. Bonding treatment and ball milling (BTBM) were used, and the effects of BTBM on the characteristics of the powders, rheological properties of the feedstock, shrinkage and properties of the sintered samples were studied. The morphology of the powder changed from extremely agglomerated small particles to pebble-shaped smooth large particles which were composed of several small particles combined tightly. The tap density increased from 3.25 g/cm(3) to 7.22 g/cm(3), and the specific surface area decreased from 0.86 m(2)/g to 0.45 m(2)/g. The critical powder loading of the feedstock increased from 45 vol.% to 56 vol.% due to the change in powder characteristics, thereby improving densification and dimension precision. For the PIM samples sintered at 1290 °C for 120 min in a hydrogen gas, the oversizing factor decreased from 1.297 to 1.216, and the dimension fluctuation ratio decreased from ±0.61% to ±0.33%. At the same time, the relative density increased from 97.8% to 98.6%, the thermal conductivity increased from 218 W/(m·K) to 233 W/(m·K), and the average coefficients of thermal expansion were roughly similar, within the range of 8.43–8.52 × 10(−6)/K. MDPI 2021-04-10 /pmc/articles/PMC8070053/ /pubmed/33920304 http://dx.doi.org/10.3390/ma14081897 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Ouyang, Mingliang
Wang, Cuiping
Zhang, Huayu
Liu, Xingjun
Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title_full Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title_fullStr Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title_full_unstemmed Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title_short Effects of Bonding Treatment and Ball Milling on W-20 wt.% Cu Composite Powder for Injection Molding
title_sort effects of bonding treatment and ball milling on w-20 wt.% cu composite powder for injection molding
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8070053/
https://www.ncbi.nlm.nih.gov/pubmed/33920304
http://dx.doi.org/10.3390/ma14081897
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