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Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-g...
Autores principales: | , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer Nature Singapore
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8113436/ https://www.ncbi.nlm.nih.gov/pubmed/34138351 http://dx.doi.org/10.1007/s40820-021-00652-0 |
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author | Wang, Mengyan Zhang, Quan Bo, Yiwen Zhang, Chunyang Lv, Yiwen Fu, Xiang He, Wen Fan, Xiangqian Liang, Jiajie Huang, Yi Ma, Rujun Chen, Yongsheng |
author_facet | Wang, Mengyan Zhang, Quan Bo, Yiwen Zhang, Chunyang Lv, Yiwen Fu, Xiang He, Wen Fan, Xiangqian Liang, Jiajie Huang, Yi Ma, Rujun Chen, Yongsheng |
author_sort | Wang, Mengyan |
collection | PubMed |
description | HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm(−1) and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm(−1) by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-021-00652-0. |
format | Online Article Text |
id | pubmed-8113436 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | Springer Nature Singapore |
record_format | MEDLINE/PubMed |
spelling | pubmed-81134362021-06-14 Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature Wang, Mengyan Zhang, Quan Bo, Yiwen Zhang, Chunyang Lv, Yiwen Fu, Xiang He, Wen Fan, Xiangqian Liang, Jiajie Huang, Yi Ma, Rujun Chen, Yongsheng Nanomicro Lett Article HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm(−1) and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm(−1) by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-021-00652-0. Springer Nature Singapore 2021-05-11 /pmc/articles/PMC8113436/ /pubmed/34138351 http://dx.doi.org/10.1007/s40820-021-00652-0 Text en © The Author(s) 2021 https://creativecommons.org/licenses/by/4.0/Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) . |
spellingShingle | Article Wang, Mengyan Zhang, Quan Bo, Yiwen Zhang, Chunyang Lv, Yiwen Fu, Xiang He, Wen Fan, Xiangqian Liang, Jiajie Huang, Yi Ma, Rujun Chen, Yongsheng Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title_full | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title_fullStr | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title_full_unstemmed | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title_short | Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature |
title_sort | highly stretchable shape memory self-soldering conductive tape with reversible adhesion switched by temperature |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8113436/ https://www.ncbi.nlm.nih.gov/pubmed/34138351 http://dx.doi.org/10.1007/s40820-021-00652-0 |
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