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Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature

HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-g...

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Autores principales: Wang, Mengyan, Zhang, Quan, Bo, Yiwen, Zhang, Chunyang, Lv, Yiwen, Fu, Xiang, He, Wen, Fan, Xiangqian, Liang, Jiajie, Huang, Yi, Ma, Rujun, Chen, Yongsheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Nature Singapore 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8113436/
https://www.ncbi.nlm.nih.gov/pubmed/34138351
http://dx.doi.org/10.1007/s40820-021-00652-0
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author Wang, Mengyan
Zhang, Quan
Bo, Yiwen
Zhang, Chunyang
Lv, Yiwen
Fu, Xiang
He, Wen
Fan, Xiangqian
Liang, Jiajie
Huang, Yi
Ma, Rujun
Chen, Yongsheng
author_facet Wang, Mengyan
Zhang, Quan
Bo, Yiwen
Zhang, Chunyang
Lv, Yiwen
Fu, Xiang
He, Wen
Fan, Xiangqian
Liang, Jiajie
Huang, Yi
Ma, Rujun
Chen, Yongsheng
author_sort Wang, Mengyan
collection PubMed
description HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm(−1) and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm(−1) by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-021-00652-0.
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spelling pubmed-81134362021-06-14 Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature Wang, Mengyan Zhang, Quan Bo, Yiwen Zhang, Chunyang Lv, Yiwen Fu, Xiang He, Wen Fan, Xiangqian Liang, Jiajie Huang, Yi Ma, Rujun Chen, Yongsheng Nanomicro Lett Article HIGHLIGHTS: Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. ABSTRACT: With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm(−1) and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm(−1) by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future. [Image: see text] SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s40820-021-00652-0. Springer Nature Singapore 2021-05-11 /pmc/articles/PMC8113436/ /pubmed/34138351 http://dx.doi.org/10.1007/s40820-021-00652-0 Text en © The Author(s) 2021 https://creativecommons.org/licenses/by/4.0/Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Wang, Mengyan
Zhang, Quan
Bo, Yiwen
Zhang, Chunyang
Lv, Yiwen
Fu, Xiang
He, Wen
Fan, Xiangqian
Liang, Jiajie
Huang, Yi
Ma, Rujun
Chen, Yongsheng
Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title_full Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title_fullStr Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title_full_unstemmed Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title_short Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature
title_sort highly stretchable shape memory self-soldering conductive tape with reversible adhesion switched by temperature
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8113436/
https://www.ncbi.nlm.nih.gov/pubmed/34138351
http://dx.doi.org/10.1007/s40820-021-00652-0
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