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Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized pre...

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Autores principales: Shabanov, Nabi S., Rabadanov, Kamil Sh., Suleymanov, Sagim I., Amirov, Akhmed M., Isaev, Abdulgalim B., Sobola, Dinara S., Murliev, Eldar K., Asvarova, Gulnara A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8123473/
https://www.ncbi.nlm.nih.gov/pubmed/33925841
http://dx.doi.org/10.3390/ma14092218
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author Shabanov, Nabi S.
Rabadanov, Kamil Sh.
Suleymanov, Sagim I.
Amirov, Akhmed M.
Isaev, Abdulgalim B.
Sobola, Dinara S.
Murliev, Eldar K.
Asvarova, Gulnara A.
author_facet Shabanov, Nabi S.
Rabadanov, Kamil Sh.
Suleymanov, Sagim I.
Amirov, Akhmed M.
Isaev, Abdulgalim B.
Sobola, Dinara S.
Murliev, Eldar K.
Asvarova, Gulnara A.
author_sort Shabanov, Nabi S.
collection PubMed
description The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.
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spelling pubmed-81234732021-05-16 Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components Shabanov, Nabi S. Rabadanov, Kamil Sh. Suleymanov, Sagim I. Amirov, Akhmed M. Isaev, Abdulgalim B. Sobola, Dinara S. Murliev, Eldar K. Asvarova, Gulnara A. Materials (Basel) Article The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements. MDPI 2021-04-26 /pmc/articles/PMC8123473/ /pubmed/33925841 http://dx.doi.org/10.3390/ma14092218 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Shabanov, Nabi S.
Rabadanov, Kamil Sh.
Suleymanov, Sagim I.
Amirov, Akhmed M.
Isaev, Abdulgalim B.
Sobola, Dinara S.
Murliev, Eldar K.
Asvarova, Gulnara A.
Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title_full Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title_fullStr Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title_full_unstemmed Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title_short Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
title_sort water-soluble copper ink for the inkjet fabrication of flexible electronic components
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8123473/
https://www.ncbi.nlm.nih.gov/pubmed/33925841
http://dx.doi.org/10.3390/ma14092218
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