Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

In this study, the interfacial reactions and mechanical properties of solder joints after multiple reflows were observed to evaluate the applicability of the developed materials for high-temperature soldering for automotive electronic components. The microstructural changes and mechanical properties...

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Detalles Bibliográficos
Autores principales: Son, Junhyuk, Yu, Dong-Yurl, Kim, Yun-Chan, Kim, Shin-Il, Kim, Min-Su, Byun, Dongjin, Bang, Junghwan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8124325/
https://www.ncbi.nlm.nih.gov/pubmed/34063188
http://dx.doi.org/10.3390/ma14092367

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8124325/
https://www.ncbi.nlm.nih.gov/pubmed/34063188
http://dx.doi.org/10.3390/ma14092367

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