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A novel method for in situ TEM measurements of adhesion at the diamond–metal interface
The procedure for in situ TEM measurements of bonding strength (adhesion) between diamond and the metal matrix using a Hysitron PI 95 TEM Picoindenter holder for mechanical tests and Push-to-Pull devices was proposed. For tensile tests, dog-bone shaped lamellae 280–330 nm thick and ~ 2.5 µm long wer...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8139953/ https://www.ncbi.nlm.nih.gov/pubmed/34021180 http://dx.doi.org/10.1038/s41598-021-89536-2 |