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A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

A novel bonding process using Ag agglomerates paste prepared by Ag(2)O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag(2)O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–Ag bonding, a shear strength of 28.3 MPa a...

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Detalles Bibliográficos
Autores principales: Li, Junlong, Xu, Yang, Meng, Ying, Yin, Zhen, Zhao, Xuelong, Wang, Yinghui, Suga, Tadatomo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8148216/
https://www.ncbi.nlm.nih.gov/pubmed/34066359
http://dx.doi.org/10.3390/mi12050521
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author Li, Junlong
Xu, Yang
Meng, Ying
Yin, Zhen
Zhao, Xuelong
Wang, Yinghui
Suga, Tadatomo
author_facet Li, Junlong
Xu, Yang
Meng, Ying
Yin, Zhen
Zhao, Xuelong
Wang, Yinghui
Suga, Tadatomo
author_sort Li, Junlong
collection PubMed
description A novel bonding process using Ag agglomerates paste prepared by Ag(2)O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag(2)O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–Ag bonding, a shear strength of 28.3 MPa at 150 °C was obtained. Further studies showed that the optimum sintering temperature was at 225 °C, and a shear strength of 46.4 MPa was obtained. In addition, a shear strength of 20 MPa was obtained at 225 °C for Cu–Cu bonding. Compared to common Ag pastes, the results in this paper revealed that the sintering behavior of Ag agglomerates was unique, and the sintering mechanisms for Ag–Ag and Cu–Cu bonding were also discussed.
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spelling pubmed-81482162021-05-26 A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature Li, Junlong Xu, Yang Meng, Ying Yin, Zhen Zhao, Xuelong Wang, Yinghui Suga, Tadatomo Micromachines (Basel) Article A novel bonding process using Ag agglomerates paste prepared by Ag(2)O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag(2)O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–Ag bonding, a shear strength of 28.3 MPa at 150 °C was obtained. Further studies showed that the optimum sintering temperature was at 225 °C, and a shear strength of 46.4 MPa was obtained. In addition, a shear strength of 20 MPa was obtained at 225 °C for Cu–Cu bonding. Compared to common Ag pastes, the results in this paper revealed that the sintering behavior of Ag agglomerates was unique, and the sintering mechanisms for Ag–Ag and Cu–Cu bonding were also discussed. MDPI 2021-05-06 /pmc/articles/PMC8148216/ /pubmed/34066359 http://dx.doi.org/10.3390/mi12050521 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Li, Junlong
Xu, Yang
Meng, Ying
Yin, Zhen
Zhao, Xuelong
Wang, Yinghui
Suga, Tadatomo
A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title_full A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title_fullStr A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title_full_unstemmed A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title_short A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature
title_sort novel preparation of ag agglomerates paste with unique sintering behavior at low temperature
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8148216/
https://www.ncbi.nlm.nih.gov/pubmed/34066359
http://dx.doi.org/10.3390/mi12050521
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