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A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

A novel bonding process using Ag agglomerates paste prepared by Ag(2)O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag(2)O sintering process for Cu–Cu bonding. By applying the Ag agglomerate paste to Ag–Ag bonding, a shear strength of 28.3 MPa a...

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Detalles Bibliográficos
Autores principales:	Li, Junlong, Xu, Yang, Meng, Ying, Yin, Zhen, Zhao, Xuelong, Wang, Yinghui, Suga, Tadatomo
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8148216/ https://www.ncbi.nlm.nih.gov/pubmed/34066359 http://dx.doi.org/10.3390/mi12050521

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