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Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration

The crystallographic characteristic effect of Cu substrate on cathode dissolution behavior in line-type Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints during electromigration (EM) was investigated by scanning electron microscope (SEM), electron backscatter diffraction (EBSD), and first-principles calcu...

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Detalles Bibliográficos
Autores principales:	Yue, Wu, Ding, Chao, Qin, Hongbo, Gong, Chenggong, Zhang, Junxi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8151550/ https://www.ncbi.nlm.nih.gov/pubmed/34064928 http://dx.doi.org/10.3390/ma14102486

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