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A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films

We report on the delithiation of LiCoO(2) thin films using oxalic acid (C(2)H(2)O(4)) with the goal of understanding the structural degradation of an insertion oxide associated with Li chemical extraction. Using a multi-technique approach that includes synchrotron radiation X-ray diffraction, scanni...

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Autores principales: Salagre, E., Quílez, S., de Benito, R., Jaafar, M., van der Meulen, H. P., Vasco, E., Cid, R., Fuller, E. J., Talin, A. A., Segovia, P., Michel, E. G., Polop, C.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8187655/
https://www.ncbi.nlm.nih.gov/pubmed/34103560
http://dx.doi.org/10.1038/s41598-021-91051-3
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author Salagre, E.
Quílez, S.
de Benito, R.
Jaafar, M.
van der Meulen, H. P.
Vasco, E.
Cid, R.
Fuller, E. J.
Talin, A. A.
Segovia, P.
Michel, E. G.
Polop, C.
author_facet Salagre, E.
Quílez, S.
de Benito, R.
Jaafar, M.
van der Meulen, H. P.
Vasco, E.
Cid, R.
Fuller, E. J.
Talin, A. A.
Segovia, P.
Michel, E. G.
Polop, C.
author_sort Salagre, E.
collection PubMed
description We report on the delithiation of LiCoO(2) thin films using oxalic acid (C(2)H(2)O(4)) with the goal of understanding the structural degradation of an insertion oxide associated with Li chemical extraction. Using a multi-technique approach that includes synchrotron radiation X-ray diffraction, scanning electron microscopy, micro Raman spectroscopy, photoelectron spectroscopy and conductive atomic force microscopy we reveal the balance between selective Li extraction and structural damage. We identify three different delithiation regimes, related to surface processes, bulk delithiation and damage generation. We find that only a fraction of the grains is affected by the delithiation process, which may create local inhomogeneities. However, the bulk delithiation regime is effective to delithiate the LCO film. All experimental evidence collected indicates that the delithiation process in this regime mimics the behavior of LCO upon electrochemical delithiation. We discard the formation of Co oxalate during the chemical extraction process. In conclusion, the chemical route to Li extraction provides additional opportunities to investigate delithiation while avoiding the complications associated with electrolyte breakdown and simplifying in-situ measurements.
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spelling pubmed-81876552021-06-09 A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films Salagre, E. Quílez, S. de Benito, R. Jaafar, M. van der Meulen, H. P. Vasco, E. Cid, R. Fuller, E. J. Talin, A. A. Segovia, P. Michel, E. G. Polop, C. Sci Rep Article We report on the delithiation of LiCoO(2) thin films using oxalic acid (C(2)H(2)O(4)) with the goal of understanding the structural degradation of an insertion oxide associated with Li chemical extraction. Using a multi-technique approach that includes synchrotron radiation X-ray diffraction, scanning electron microscopy, micro Raman spectroscopy, photoelectron spectroscopy and conductive atomic force microscopy we reveal the balance between selective Li extraction and structural damage. We identify three different delithiation regimes, related to surface processes, bulk delithiation and damage generation. We find that only a fraction of the grains is affected by the delithiation process, which may create local inhomogeneities. However, the bulk delithiation regime is effective to delithiate the LCO film. All experimental evidence collected indicates that the delithiation process in this regime mimics the behavior of LCO upon electrochemical delithiation. We discard the formation of Co oxalate during the chemical extraction process. In conclusion, the chemical route to Li extraction provides additional opportunities to investigate delithiation while avoiding the complications associated with electrolyte breakdown and simplifying in-situ measurements. Nature Publishing Group UK 2021-06-08 /pmc/articles/PMC8187655/ /pubmed/34103560 http://dx.doi.org/10.1038/s41598-021-91051-3 Text en © The Author(s) 2021 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Salagre, E.
Quílez, S.
de Benito, R.
Jaafar, M.
van der Meulen, H. P.
Vasco, E.
Cid, R.
Fuller, E. J.
Talin, A. A.
Segovia, P.
Michel, E. G.
Polop, C.
A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title_full A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title_fullStr A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title_full_unstemmed A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title_short A multi-technique approach to understanding delithiation damage in LiCoO(2) thin films
title_sort multi-technique approach to understanding delithiation damage in licoo(2) thin films
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8187655/
https://www.ncbi.nlm.nih.gov/pubmed/34103560
http://dx.doi.org/10.1038/s41598-021-91051-3
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