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Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform

[Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency...

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Autores principales: Messner, Andreas, Jud, Pascal A., Winiger, Joel, Eppenberger, Marco, Chelladurai, Daniel, Heni, Wolfgang, Baeuerle, Benedikt, Koch, Ueli, Ma, Ping, Haffner, Christian, Xu, Huajun, Elder, Delwin L., Dalton, Larry R., Smajic, Jasmin, Leuthold, Juerg
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2021
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8193629/
https://www.ncbi.nlm.nih.gov/pubmed/34006114
http://dx.doi.org/10.1021/acs.nanolett.0c05069
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author Messner, Andreas
Jud, Pascal A.
Winiger, Joel
Eppenberger, Marco
Chelladurai, Daniel
Heni, Wolfgang
Baeuerle, Benedikt
Koch, Ueli
Ma, Ping
Haffner, Christian
Xu, Huajun
Elder, Delwin L.
Dalton, Larry R.
Smajic, Jasmin
Leuthold, Juerg
author_facet Messner, Andreas
Jud, Pascal A.
Winiger, Joel
Eppenberger, Marco
Chelladurai, Daniel
Heni, Wolfgang
Baeuerle, Benedikt
Koch, Ueli
Ma, Ping
Haffner, Christian
Xu, Huajun
Elder, Delwin L.
Dalton, Larry R.
Smajic, Jasmin
Leuthold, Juerg
author_sort Messner, Andreas
collection PubMed
description [Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices’ broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications.
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spelling pubmed-81936292021-06-11 Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform Messner, Andreas Jud, Pascal A. Winiger, Joel Eppenberger, Marco Chelladurai, Daniel Heni, Wolfgang Baeuerle, Benedikt Koch, Ueli Ma, Ping Haffner, Christian Xu, Huajun Elder, Delwin L. Dalton, Larry R. Smajic, Jasmin Leuthold, Juerg Nano Lett [Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices’ broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications. American Chemical Society 2021-05-18 2021-06-09 /pmc/articles/PMC8193629/ /pubmed/34006114 http://dx.doi.org/10.1021/acs.nanolett.0c05069 Text en © 2021 The Authors. Published by American Chemical Society Permits non-commercial access and re-use, provided that author attribution and integrity are maintained; but does not permit creation of adaptations or other derivative works (https://creativecommons.org/licenses/by-nc-nd/4.0/).
spellingShingle Messner, Andreas
Jud, Pascal A.
Winiger, Joel
Eppenberger, Marco
Chelladurai, Daniel
Heni, Wolfgang
Baeuerle, Benedikt
Koch, Ueli
Ma, Ping
Haffner, Christian
Xu, Huajun
Elder, Delwin L.
Dalton, Larry R.
Smajic, Jasmin
Leuthold, Juerg
Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title_full Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title_fullStr Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title_full_unstemmed Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title_short Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
title_sort broadband metallic fiber-to-chip couplers and a low-complexity integrated plasmonic platform
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8193629/
https://www.ncbi.nlm.nih.gov/pubmed/34006114
http://dx.doi.org/10.1021/acs.nanolett.0c05069
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