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Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
[Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency...
Autores principales: | , , , , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical Society
2021
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8193629/ https://www.ncbi.nlm.nih.gov/pubmed/34006114 http://dx.doi.org/10.1021/acs.nanolett.0c05069 |
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author | Messner, Andreas Jud, Pascal A. Winiger, Joel Eppenberger, Marco Chelladurai, Daniel Heni, Wolfgang Baeuerle, Benedikt Koch, Ueli Ma, Ping Haffner, Christian Xu, Huajun Elder, Delwin L. Dalton, Larry R. Smajic, Jasmin Leuthold, Juerg |
author_facet | Messner, Andreas Jud, Pascal A. Winiger, Joel Eppenberger, Marco Chelladurai, Daniel Heni, Wolfgang Baeuerle, Benedikt Koch, Ueli Ma, Ping Haffner, Christian Xu, Huajun Elder, Delwin L. Dalton, Larry R. Smajic, Jasmin Leuthold, Juerg |
author_sort | Messner, Andreas |
collection | PubMed |
description | [Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices’ broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications. |
format | Online Article Text |
id | pubmed-8193629 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | American Chemical Society |
record_format | MEDLINE/PubMed |
spelling | pubmed-81936292021-06-11 Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform Messner, Andreas Jud, Pascal A. Winiger, Joel Eppenberger, Marco Chelladurai, Daniel Heni, Wolfgang Baeuerle, Benedikt Koch, Ueli Ma, Ping Haffner, Christian Xu, Huajun Elder, Delwin L. Dalton, Larry R. Smajic, Jasmin Leuthold, Juerg Nano Lett [Image: see text] We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices’ broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications. American Chemical Society 2021-05-18 2021-06-09 /pmc/articles/PMC8193629/ /pubmed/34006114 http://dx.doi.org/10.1021/acs.nanolett.0c05069 Text en © 2021 The Authors. Published by American Chemical Society Permits non-commercial access and re-use, provided that author attribution and integrity are maintained; but does not permit creation of adaptations or other derivative works (https://creativecommons.org/licenses/by-nc-nd/4.0/). |
spellingShingle | Messner, Andreas Jud, Pascal A. Winiger, Joel Eppenberger, Marco Chelladurai, Daniel Heni, Wolfgang Baeuerle, Benedikt Koch, Ueli Ma, Ping Haffner, Christian Xu, Huajun Elder, Delwin L. Dalton, Larry R. Smajic, Jasmin Leuthold, Juerg Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform |
title | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity
Integrated Plasmonic Platform |
title_full | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity
Integrated Plasmonic Platform |
title_fullStr | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity
Integrated Plasmonic Platform |
title_full_unstemmed | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity
Integrated Plasmonic Platform |
title_short | Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity
Integrated Plasmonic Platform |
title_sort | broadband metallic fiber-to-chip couplers and a low-complexity
integrated plasmonic platform |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8193629/ https://www.ncbi.nlm.nih.gov/pubmed/34006114 http://dx.doi.org/10.1021/acs.nanolett.0c05069 |
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