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Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was c...

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Detalles Bibliográficos
Autores principales:	Franieck, Erick, Fleischmann, Martin, Hölck, Ole, Kutuzova, Larysa, Kandelbauer, Andreas
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8197812/ https://www.ncbi.nlm.nih.gov/pubmed/34073271 http://dx.doi.org/10.3390/polym13111734

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