Cargando…
Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the therm...
Autores principales: | Skwarek, Agata, Krammer, Olivér, Hurtony, Tamás, Ptak, Przemysław, Górecki, Krzysztof, Wroński, Sebastian, Straubinger, Dániel, Witek, Krzysztof, Illés, Balázs |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8230862/ https://www.ncbi.nlm.nih.gov/pubmed/34208099 http://dx.doi.org/10.3390/nano11061545 |
Ejemplares similares
-
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb
por: Skwarek, Agata, et al.
Publicado: (2020) -
Microstructure Influence of SACX0307-TiO(2) Composite Solder Joints on Thermal Properties of Power LED Assemblies
por: Skwarek, Agata, et al.
Publicado: (2020) -
Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021) -
Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023) -
Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
por: Roduan, Siti Faqihah, et al.
Publicado: (2022)