Ultrasonic-assisted electrodeposition of Cu-Sn-TiO(2) nanocomposite coatings with enhanced antibacterial activity

Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu–Sn–TiO(2) coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm(3) TiO(2) with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm(3) power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO(2) phase in the Cu–Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO(2) particles and allows for the deposition of dense Cu–Sn–TiO(2) nanocomposites. It is shown that nanocomposite Cu–Sn–TiO(2) coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.