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Electrical Interconnection and Bonding by Nano-Locking
The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with th...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8233979/ https://www.ncbi.nlm.nih.gov/pubmed/34204330 http://dx.doi.org/10.3390/nano11061589 |
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author | Guo, Jielin Shih, Yu-Chou Shi, Frank G. |
author_facet | Guo, Jielin Shih, Yu-Chou Shi, Frank G. |
author_sort | Guo, Jielin |
collection | PubMed |
description | The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with the concept of “nano-locking” (NL) is proposed: the two surfaces are locked together for electrical interconnection, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. The general applicability of this new method was investigated by applying the method to the die-substrate bonding of two different packages from two different manufacturers. Electrical, optical, and thermal performances as well as reliability tests were carried out. The surface morphology of the bonding package substrates plays an important role in determining the contact resistance at the bonding interfaces. It was shown that samples with different roughness height distribution on the metallic surfaces formed a different total number of contacts and the contact area between the two bonding surfaces under the same bond-line thickness (BLT): a larger number of contact area resulted in a reduced electrical resistance, and thus an improved overall device performance and reliability. |
format | Online Article Text |
id | pubmed-8233979 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-82339792021-06-27 Electrical Interconnection and Bonding by Nano-Locking Guo, Jielin Shih, Yu-Chou Shi, Frank G. Nanomaterials (Basel) Article The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with the concept of “nano-locking” (NL) is proposed: the two surfaces are locked together for electrical interconnection, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. The general applicability of this new method was investigated by applying the method to the die-substrate bonding of two different packages from two different manufacturers. Electrical, optical, and thermal performances as well as reliability tests were carried out. The surface morphology of the bonding package substrates plays an important role in determining the contact resistance at the bonding interfaces. It was shown that samples with different roughness height distribution on the metallic surfaces formed a different total number of contacts and the contact area between the two bonding surfaces under the same bond-line thickness (BLT): a larger number of contact area resulted in a reduced electrical resistance, and thus an improved overall device performance and reliability. MDPI 2021-06-17 /pmc/articles/PMC8233979/ /pubmed/34204330 http://dx.doi.org/10.3390/nano11061589 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Guo, Jielin Shih, Yu-Chou Shi, Frank G. Electrical Interconnection and Bonding by Nano-Locking |
title | Electrical Interconnection and Bonding by Nano-Locking |
title_full | Electrical Interconnection and Bonding by Nano-Locking |
title_fullStr | Electrical Interconnection and Bonding by Nano-Locking |
title_full_unstemmed | Electrical Interconnection and Bonding by Nano-Locking |
title_short | Electrical Interconnection and Bonding by Nano-Locking |
title_sort | electrical interconnection and bonding by nano-locking |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8233979/ https://www.ncbi.nlm.nih.gov/pubmed/34204330 http://dx.doi.org/10.3390/nano11061589 |
work_keys_str_mv | AT guojielin electricalinterconnectionandbondingbynanolocking AT shihyuchou electricalinterconnectionandbondingbynanolocking AT shifrankg electricalinterconnectionandbondingbynanolocking |