Cargando…

Electrical Interconnection and Bonding by Nano-Locking

The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with th...

Descripción completa

Detalles Bibliográficos
Autores principales: Guo, Jielin, Shih, Yu-Chou, Shi, Frank G.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8233979/
https://www.ncbi.nlm.nih.gov/pubmed/34204330
http://dx.doi.org/10.3390/nano11061589
_version_ 1783713976169791488
author Guo, Jielin
Shih, Yu-Chou
Shi, Frank G.
author_facet Guo, Jielin
Shih, Yu-Chou
Shi, Frank G.
author_sort Guo, Jielin
collection PubMed
description The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with the concept of “nano-locking” (NL) is proposed: the two surfaces are locked together for electrical interconnection, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. The general applicability of this new method was investigated by applying the method to the die-substrate bonding of two different packages from two different manufacturers. Electrical, optical, and thermal performances as well as reliability tests were carried out. The surface morphology of the bonding package substrates plays an important role in determining the contact resistance at the bonding interfaces. It was shown that samples with different roughness height distribution on the metallic surfaces formed a different total number of contacts and the contact area between the two bonding surfaces under the same bond-line thickness (BLT): a larger number of contact area resulted in a reduced electrical resistance, and thus an improved overall device performance and reliability.
format Online
Article
Text
id pubmed-8233979
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-82339792021-06-27 Electrical Interconnection and Bonding by Nano-Locking Guo, Jielin Shih, Yu-Chou Shi, Frank G. Nanomaterials (Basel) Article The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with the concept of “nano-locking” (NL) is proposed: the two surfaces are locked together for electrical interconnection, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. The general applicability of this new method was investigated by applying the method to the die-substrate bonding of two different packages from two different manufacturers. Electrical, optical, and thermal performances as well as reliability tests were carried out. The surface morphology of the bonding package substrates plays an important role in determining the contact resistance at the bonding interfaces. It was shown that samples with different roughness height distribution on the metallic surfaces formed a different total number of contacts and the contact area between the two bonding surfaces under the same bond-line thickness (BLT): a larger number of contact area resulted in a reduced electrical resistance, and thus an improved overall device performance and reliability. MDPI 2021-06-17 /pmc/articles/PMC8233979/ /pubmed/34204330 http://dx.doi.org/10.3390/nano11061589 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Guo, Jielin
Shih, Yu-Chou
Shi, Frank G.
Electrical Interconnection and Bonding by Nano-Locking
title Electrical Interconnection and Bonding by Nano-Locking
title_full Electrical Interconnection and Bonding by Nano-Locking
title_fullStr Electrical Interconnection and Bonding by Nano-Locking
title_full_unstemmed Electrical Interconnection and Bonding by Nano-Locking
title_short Electrical Interconnection and Bonding by Nano-Locking
title_sort electrical interconnection and bonding by nano-locking
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8233979/
https://www.ncbi.nlm.nih.gov/pubmed/34204330
http://dx.doi.org/10.3390/nano11061589
work_keys_str_mv AT guojielin electricalinterconnectionandbondingbynanolocking
AT shihyuchou electricalinterconnectionandbondingbynanolocking
AT shifrankg electricalinterconnectionandbondingbynanolocking