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Electrical Interconnection and Bonding by Nano-Locking
The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with th...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8233979/ https://www.ncbi.nlm.nih.gov/pubmed/34204330 http://dx.doi.org/10.3390/nano11061589 |