Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., sten...

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Detalles Bibliográficos
Autores principales: Makrygianni, Marina, Zacharatos, Filimon, Andritsos, Kostas, Theodorakos, Ioannis, Reppas, Dimitris, Oikonomidis, Nikolaos, Spandonidis, Christos, Zergioti, Ioanna
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8235500/
https://www.ncbi.nlm.nih.gov/pubmed/34204373
http://dx.doi.org/10.3390/ma14123353

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