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Area Selective Deposition of Metals from the Electrical Resistivity of the Substrate
[Image: see text] Area selective deposition (ASD) of films only on desired areas of the substrate opens for less complex fabrication of nanoscaled electronics. We show that a newly developed CVD method, where plasma electrons are used as the reducing agent in deposition of metallic thin films, is in...
Autores principales: | Nadhom, Hama, Boyd, Robert, Rouf, Polla, Lundin, Daniel, Pedersen, Henrik |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical
Society
2021
|
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8279735/ https://www.ncbi.nlm.nih.gov/pubmed/33886327 http://dx.doi.org/10.1021/acs.jpclett.1c00415 |
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