Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al(2)O(3) Ceramics Substrate

Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al(2)O(3) ceramics substrate was studied. Two laser trepanning patterns were evaluated, filled spiral trepanning and multiple rings trepanning, with the optimized laser machining parameters. In conjunction with the studies, the hole saturated taper and the saturated processing time were taken as the primary criteria for evaluation of the hole quality and the machining efficiency, respectively. Finally, the trepanning patterns were optimized aiming for the high hole quality; the process was based on the saturated hole tapers. The hole high qualities and machining efficiencies were obtained based on the saturated processing time, which was proven to have a great significance when using the nanosecond pulse laser to machine Al(2)O(3) ceramics substrate.