Deep-Sintered Copper Tracks for Thermal Oxidation Resistance Using Large Pulsed Electron Beam

[Image: see text] Thermal oxidation resistance is an important property in printed electronics for sustaining electrical conductivity for long time and/or under harsh environments such as high temperature. This study reports the fabrication of copper nanoparticles (CuNPs)-based conductive tracks using large pulsed electron beam (LPEB) by irradiation on CuNPs to be sintered. With an acceleration voltage of 11 kV, the LPEB irradiation induced deep-sintering of CuNPs so that the sintered CuNPs exhibited bulk-like electrical conductivity. Consequently, the sintered Cu tracks maintained high electrical conductivity at 220 °C without using any thermal oxidation protection additive, such as silver, carbon nanotube, and graphene. In contrast, the films irradiated with an acceleration voltage of 8 kV and irradiated by intense pulsed light (IPL) showed fast oxidation characteristics and a corresponding reduction of electrical conductivities under high temperatures owing to a thin sintered layer. The performance of highly thermal oxidation-resistant Cu films sintered by LPEB irradiations was demonstrated through the device performance of a Joule heater.