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Preparation of Bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane and Investigation of Its Cationic UV-Curing Material Properties
Precusor EHO(3-ethyl-3-hydroxymethyloxetane) was synthesized with diethyl carbonate and trihydroxypropane as the main raw materials. Intermediate AllyEHO(3-ethyl-3-allylmethoxyoxetane) was synthesized with 3-ethyl-3-hydroxymethyloxetane and allyl bromide as the main raw materials. Prepolymer bis[(3-...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8347805/ https://www.ncbi.nlm.nih.gov/pubmed/34372177 http://dx.doi.org/10.3390/polym13152573 |
Sumario: | Precusor EHO(3-ethyl-3-hydroxymethyloxetane) was synthesized with diethyl carbonate and trihydroxypropane as the main raw materials. Intermediate AllyEHO(3-ethyl-3-allylmethoxyoxetane) was synthesized with 3-ethyl-3-hydroxymethyloxetane and allyl bromide as the main raw materials. Prepolymer bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane was synthesized with 3-ethyl-3-methoxyoxetane)propyl and diphenylsilane. Photoinitiator triarylsulfonium hexafluoroantimonate of 3% was added to the prepolymer, and a novel kind of the photosensitive resin was prepared. They were analyzed and characterized with FTIR and (1)H-NMR. Photo-DSC examination revealed that the bis[(3-ethyl-3-methoxyoxetane)propyl]diphenylsilane has great photosensitivity. The thermal properties and mechanical properties of the photosensitive resin were examined by TGA and a microcomputer-controlled universal material testing machine, with thermal stabilities of up to 446 °C. The tensile strength was 75.5 MPa and the bending strength was 49.5 MPa. The light transmittance remained above 98%. |
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