Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrica...

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Detalles Bibliográficos
Autores principales: Xu, Yilin, Maier, Pascal, Blaicher, Matthias, Dietrich, Philipp-Immanuel, Marin-Palomo, Pablo, Hartmann, Wladislaw, Bao, Yiyang, Peng, Huanfa, Billah, Muhammad Rodlin, Singer, Stefan, Troppenz, Ute, Moehrle, Martin, Randel, Sebastian, Freude, Wolfgang, Koos, Christian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8361180/
https://www.ncbi.nlm.nih.gov/pubmed/34385575
http://dx.doi.org/10.1038/s41598-021-95981-w

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