Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications o...

Descripción completa

Detalles Bibliográficos
Autores principales: Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398582/
https://www.ncbi.nlm.nih.gov/pubmed/34442568
http://dx.doi.org/10.3390/mi12080946

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398582/
https://www.ncbi.nlm.nih.gov/pubmed/34442568
http://dx.doi.org/10.3390/mi12080946

Ejemplares similares