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Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications o...

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Detalles Bibliográficos
Autores principales:	Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Review
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398582/ https://www.ncbi.nlm.nih.gov/pubmed/34442568 http://dx.doi.org/10.3390/mi12080946

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