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White-Light-Emitting Supramolecular Polymer Gel Based on β-CD and NDI Host-Guest Inclusion Complex
Supramolecular polymer formed by non-covalent interactions between complementary building blocks entraps solvents and develops supramolecular polymer gel. A supramolecular polymer gel was prepared by the heating-cooling cycle of β-cyclodextrin (β-CD) and naphthalenedimide (NDI) solution in N,N-dimet...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400613/ https://www.ncbi.nlm.nih.gov/pubmed/34451301 http://dx.doi.org/10.3390/polym13162762 |
Sumario: | Supramolecular polymer formed by non-covalent interactions between complementary building blocks entraps solvents and develops supramolecular polymer gel. A supramolecular polymer gel was prepared by the heating-cooling cycle of β-cyclodextrin (β-CD) and naphthalenedimide (NDI) solution in N,N-dimethylformamide (DMF). The host-guest inclusion complex of β-CD and NDI 1 containing dodecyl amine forms the supramolecular polymer and gel in DMF. However, β-CD and NDI 2, having glutamic acid, fail to form the supramolecular polymer and gel under the same condition. X-ray crystallography shows that the alkyl chains of NDI 1 are complementary to the hydrophobic cavity of the two β-CD units. From rheology, the storage modulus was approximately 1.5 orders of magnitude larger than the loss modulus, which indicates the physical crosslink and elastic nature of the thermo-responsive gel. FE-SEM images of the supramolecular polymer gel exhibit flake-like morphology and a dense flake network. The flakes developed from the assembly of smaller rods. Photophysical studies show that the host-guest complex formation and gelation have significantly enhanced emission intensity with a new hump at 550 nm. Upon excitation by a 366 nm UV-light, NDI 1 and β-CD gel in DMF shows white light emission. The gel has the potential for the fabrication of organic electronic devices. |
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