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Fanless, porous graphene-copper composite heat sink for micro devices

Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a heat sink...

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Autores principales: Rho, Hokyun, Jang, Yea Sol, Bae, Hyojung, Cha, An-Na, Lee, Sang Hyun, Ha, Jun-Seok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8413455/
https://www.ncbi.nlm.nih.gov/pubmed/34475506
http://dx.doi.org/10.1038/s41598-021-97165-y
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author Rho, Hokyun
Jang, Yea Sol
Bae, Hyojung
Cha, An-Na
Lee, Sang Hyun
Ha, Jun-Seok
author_facet Rho, Hokyun
Jang, Yea Sol
Bae, Hyojung
Cha, An-Na
Lee, Sang Hyun
Ha, Jun-Seok
author_sort Rho, Hokyun
collection PubMed
description Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a heat sink fabricated using copper with porous structures consisting of single-layer graphene on the surface and graphene oxide inside the pores. The porous copper/single-layer graphene/graphene oxide composite (p-Cu/G/rGO) had a porosity of approximately 35%, and the measured pore size was approximately 10 to 100 µm. The internal GO was reduced at a temperature of 1000 °C. On observing the heat distribution in the structure using a thermal imaging camera, we could observe that the p-Cu/G/rGO was conducting heat faster than the p-Cu, which was consistent with the simulation. Furthermore, the thermal resistance of p-Cu/G/rGO was lower than those of the p-Cu and pure Cu. When the p-Cu/G/rGO was fabricated into a heat sink to mount the light emitting diode (LED) chip, the measured temperature of the LED was 31.04 °C, which was less than the temperature of the pure Cu of 40.8 °C. After a week of being subjected to high power (1000 mA), the light intensity of p-Cu/G/rGO decreased to 95.24%. However, the pure Cu decreased significantly to 66.04%. The results of this study are expected to be applied to micro devices for their effective thermal management.
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spelling pubmed-84134552021-09-07 Fanless, porous graphene-copper composite heat sink for micro devices Rho, Hokyun Jang, Yea Sol Bae, Hyojung Cha, An-Na Lee, Sang Hyun Ha, Jun-Seok Sci Rep Article Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a heat sink fabricated using copper with porous structures consisting of single-layer graphene on the surface and graphene oxide inside the pores. The porous copper/single-layer graphene/graphene oxide composite (p-Cu/G/rGO) had a porosity of approximately 35%, and the measured pore size was approximately 10 to 100 µm. The internal GO was reduced at a temperature of 1000 °C. On observing the heat distribution in the structure using a thermal imaging camera, we could observe that the p-Cu/G/rGO was conducting heat faster than the p-Cu, which was consistent with the simulation. Furthermore, the thermal resistance of p-Cu/G/rGO was lower than those of the p-Cu and pure Cu. When the p-Cu/G/rGO was fabricated into a heat sink to mount the light emitting diode (LED) chip, the measured temperature of the LED was 31.04 °C, which was less than the temperature of the pure Cu of 40.8 °C. After a week of being subjected to high power (1000 mA), the light intensity of p-Cu/G/rGO decreased to 95.24%. However, the pure Cu decreased significantly to 66.04%. The results of this study are expected to be applied to micro devices for their effective thermal management. Nature Publishing Group UK 2021-09-02 /pmc/articles/PMC8413455/ /pubmed/34475506 http://dx.doi.org/10.1038/s41598-021-97165-y Text en © The Author(s) 2021 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Rho, Hokyun
Jang, Yea Sol
Bae, Hyojung
Cha, An-Na
Lee, Sang Hyun
Ha, Jun-Seok
Fanless, porous graphene-copper composite heat sink for micro devices
title Fanless, porous graphene-copper composite heat sink for micro devices
title_full Fanless, porous graphene-copper composite heat sink for micro devices
title_fullStr Fanless, porous graphene-copper composite heat sink for micro devices
title_full_unstemmed Fanless, porous graphene-copper composite heat sink for micro devices
title_short Fanless, porous graphene-copper composite heat sink for micro devices
title_sort fanless, porous graphene-copper composite heat sink for micro devices
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8413455/
https://www.ncbi.nlm.nih.gov/pubmed/34475506
http://dx.doi.org/10.1038/s41598-021-97165-y
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