Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Ex...

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Autores principales: Jiang, Hongpeng, Yan, Guangqiang, Li, Jianwei, Xu, Jie, Shan, Debin, Guo, Bin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432700/
https://www.ncbi.nlm.nih.gov/pubmed/34500956
http://dx.doi.org/10.3390/ma14174869
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author Jiang, Hongpeng
Yan, Guangqiang
Li, Jianwei
Xu, Jie
Shan, Debin
Guo, Bin
author_facet Jiang, Hongpeng
Yan, Guangqiang
Li, Jianwei
Xu, Jie
Shan, Debin
Guo, Bin
author_sort Jiang, Hongpeng
collection PubMed
description Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.
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spelling pubmed-84327002021-09-11 Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper Jiang, Hongpeng Yan, Guangqiang Li, Jianwei Xu, Jie Shan, Debin Guo, Bin Materials (Basel) Article Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C. MDPI 2021-08-27 /pmc/articles/PMC8432700/ /pubmed/34500956 http://dx.doi.org/10.3390/ma14174869 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Jiang, Hongpeng
Yan, Guangqiang
Li, Jianwei
Xu, Jie
Shan, Debin
Guo, Bin
Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title_full Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title_fullStr Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title_full_unstemmed Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title_short Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper
title_sort deformation behavior and microstructural evolution of t-shape upsetting test in ultrafine-grained pure copper
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432700/
https://www.ncbi.nlm.nih.gov/pubmed/34500956
http://dx.doi.org/10.3390/ma14174869
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