Hierarchically porous polyimide/Ti(3)C(2)T(x) film with stable electromagnetic interference shielding after resisting harsh conditions

Polymer-based conductive nanocomposites are promising for electromagnetic interference (EMI) shielding to ensure stable operations of electronic devices and protect humans from electromagnetic radiation. Although MXenes have shown high EMI shielding performances, it remains a great challenge to construct highly efficient EMI shielding polymer/MXene composite films with minimal MXene content and high durability to harsh conditions. Here, hierarchically porous polyimide (PI)/Ti(3)C(2)T(x) films with consecutively conductive pathways have been constructed via a unidirectional PI aerogel–assisted immersion and hot-pressing strategy. Contributed by special architectures and high conductivities, PI/Ti(3)C(2)T(x) films with 2.0 volume % Ti(3)C(2)T(x) have high absolute EMI shielding effectiveness up to 15,527 dB cm(2) g(−1) at the thickness of 90 μm. Superior EMI shielding performance can be retained even after being subjected to hygrothermal or combustion environments, cryogenic (−196°C) or high (250°C) temperatures, and rapid thermal shock (∆T = 446°C), demonstrating high potential as high-performance EMI shielding materials resisting harsh conditions.