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Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper
Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a high microhardness of 2.1 GPa. The structure coarseni...
Autores principales: | Hou, Jianxin, Li, Xiuyan, Lu, Ke |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8466824/ https://www.ncbi.nlm.nih.gov/pubmed/34578567 http://dx.doi.org/10.3390/nano11092252 |
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