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Recycling of Expired Ceftamil Drug as Additive in the Copper and Nickel Electrodeposition from Acid Baths

Due to the large quantity of expired and unused drugs worldwide, pharmaceutical disposal has become a serious problem that requires increased attention. In the present paper, the study on recycling ceftazidime (CZ) as an additive in copper and nickel electrodeposition from acid baths is highlighted....

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Detalles Bibliográficos
Autores principales: Duca, Delia-Andrada, Dan, Mircea Laurențiu, Vaszilcsin, Nicolae
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8467844/
https://www.ncbi.nlm.nih.gov/pubmed/34574398
http://dx.doi.org/10.3390/ijerph18189476
Descripción
Sumario:Due to the large quantity of expired and unused drugs worldwide, pharmaceutical disposal has become a serious problem that requires increased attention. In the present paper, the study on recycling ceftazidime (CZ) as an additive in copper and nickel electrodeposition from acid baths is highlighted. CZ is the active substance from expired commercial drug Ceftamil(®). Its electrochemical behavior was studied by cyclic voltammetry. As well, kinetic parameters for copper and nickel electrodeposition were determined using Tafel plots method at different temperatures and CZ concentrations in these acid baths. The activation energy was calculated from Arrhenius plots. Electrochemical impedance spectroscopy was used to investigate the charge transfer resistance and coverage degree in the electrolyte solutions at several potential values. Gibbs free energy values, calculated from Langmuir adsorption isotherms, revealed the chemical nature of CZ–electrode surface interactions. The favorable effect of the organic molecules added in copper and nickel electroplating baths was emphasized by optical microscope images. The morphology of the obtained deposits without and with 10(−4) mol L(−1) CZ was compared. The experimental results revealed that expired Ceftamil(®) is suitable as additive in copper and nickel electroplating processes from acid baths.