Bioinspired Dielectric Film with Superior Mechanical Properties and Ultrahigh Electric Breakdown Strength Made from Aramid Nanofibers and Alumina Nanoplates

Materials with excellent thermal stability, mechanical, and insulating properties are highly desirable for electrical equipment with high voltage and high power. However, simultaneously integrating these performance portfolios into a single material remains a great challenge. Here, we describe a new strategy to prepare composite film by combining one-dimensional (1D) rigid aramid nanofiber (ANF) with 2D alumina (Al(2)O(3)) nanoplates using the carboxylated chitosan acting as hydrogen bonding donors as well as soft interlocking agent. A biomimetic nacreous ‘brick-and-mortar’ structure with a 3D hydrogen bonding network is constructed in the obtained ANF/chitosan/Al(2)O(3) composite films, which provides the composite films with exceptional mechanical and dielectric properties. The ANF/chitosan/Al(2)O(3) composite film exhibits an ultrahigh electric breakdown strength of 320.1 kV/mm at 15 wt % Al(2)O(3) loading, which is 50.6% higher than that of the neat ANF film. Meanwhile, a large elongation at break of 17.22% is achieved for the composite film, integrated with high tensile strength (~233 MPa), low dielectric loss (<0.02), and remarkable thermal stability. These findings shed new light on the fabrication of multifunctional insulating materials and broaden their practical applications in the field of advanced electrics and electrical devices.