Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usu...

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Detalles Bibliográficos
Autores principales: Yan, Shuang, Verestek, Wolfgang, Zeizinger, Harald, Schmauder, Siegfried
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8469284/
https://www.ncbi.nlm.nih.gov/pubmed/34577986
http://dx.doi.org/10.3390/polym13183085

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8469284/
https://www.ncbi.nlm.nih.gov/pubmed/34577986
http://dx.doi.org/10.3390/polym13183085

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