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Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers

Shape memory polymers (SMPs) are attracting attention for their use in wearable displays and biomedical materials due to their good biocompatibility and excellent moldability. SMPs also have the advantage of being lightweight with excellent shape recovery due to their low density. However, they have...

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Autores principales: Kim, Mijeong, Jang, Seongeun, Choi, Sungwoong, Yang, Junghoon, Kim, Jungpil, Choi, Duyoung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8471488/
https://www.ncbi.nlm.nih.gov/pubmed/34577752
http://dx.doi.org/10.3390/mi12091107
_version_ 1784574479736766464
author Kim, Mijeong
Jang, Seongeun
Choi, Sungwoong
Yang, Junghoon
Kim, Jungpil
Choi, Duyoung
author_facet Kim, Mijeong
Jang, Seongeun
Choi, Sungwoong
Yang, Junghoon
Kim, Jungpil
Choi, Duyoung
author_sort Kim, Mijeong
collection PubMed
description Shape memory polymers (SMPs) are attracting attention for their use in wearable displays and biomedical materials due to their good biocompatibility and excellent moldability. SMPs also have the advantage of being lightweight with excellent shape recovery due to their low density. However, they have not yet been applied to a wide range of engineering fields because of their inferior physical properties as compared to those of shape memory alloys (SMAs). In this study, we attempt to find optimized shape memory polymer composites. We also investigate the shape memory performance and physical properties according to the filler type and amount of hardener. The shape memory composite was manufactured by adding nanocarbon materials of graphite and non-carbon additives of Cu. The shape-recovery mechanism was compared, according to the type and content of the filler. The shape fixation and recovery properties were analyzed, and the physical properties of the shape recovery composite were obtained through mechanical strength, thermal conductivity and differential scanning calorimetry analysis.
format Online
Article
Text
id pubmed-8471488
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-84714882021-09-28 Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers Kim, Mijeong Jang, Seongeun Choi, Sungwoong Yang, Junghoon Kim, Jungpil Choi, Duyoung Micromachines (Basel) Article Shape memory polymers (SMPs) are attracting attention for their use in wearable displays and biomedical materials due to their good biocompatibility and excellent moldability. SMPs also have the advantage of being lightweight with excellent shape recovery due to their low density. However, they have not yet been applied to a wide range of engineering fields because of their inferior physical properties as compared to those of shape memory alloys (SMAs). In this study, we attempt to find optimized shape memory polymer composites. We also investigate the shape memory performance and physical properties according to the filler type and amount of hardener. The shape memory composite was manufactured by adding nanocarbon materials of graphite and non-carbon additives of Cu. The shape-recovery mechanism was compared, according to the type and content of the filler. The shape fixation and recovery properties were analyzed, and the physical properties of the shape recovery composite were obtained through mechanical strength, thermal conductivity and differential scanning calorimetry analysis. MDPI 2021-09-15 /pmc/articles/PMC8471488/ /pubmed/34577752 http://dx.doi.org/10.3390/mi12091107 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Kim, Mijeong
Jang, Seongeun
Choi, Sungwoong
Yang, Junghoon
Kim, Jungpil
Choi, Duyoung
Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title_full Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title_fullStr Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title_full_unstemmed Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title_short Analysis of Shape Memory Behavior and Mechanical Properties of Shape Memory Polymer Composites Using Thermal Conductive Fillers
title_sort analysis of shape memory behavior and mechanical properties of shape memory polymer composites using thermal conductive fillers
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8471488/
https://www.ncbi.nlm.nih.gov/pubmed/34577752
http://dx.doi.org/10.3390/mi12091107
work_keys_str_mv AT kimmijeong analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers
AT jangseongeun analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers
AT choisungwoong analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers
AT yangjunghoon analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers
AT kimjungpil analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers
AT choiduyoung analysisofshapememorybehaviorandmechanicalpropertiesofshapememorypolymercompositesusingthermalconductivefillers